Contract notice: An apparatus for production of metallic microstructures on wafers by means of electrochemical deposition.
An apparatus for production of metallic microstructures on wafers by means of electrochemical deposition. : The device is to be designed in a specific case for the production of metallic microstructures on a patterned semiconductor wafer earlier photo. The method is based on the thin film technology at the Fraunhofer IZM developed and established by the five processes are relevant in the following sequence here - Wetting the belackten wafer with DI water, : - The conditioning of Wafermetallisierung in MikroÄtzlÖsungen, : - The electrolytic deposition of the metal structures, : - Rinsing of the wafer with a DI water and : - Drying of the electroplated wafer with nitrogen. : These 5 process steps are to be implemented taking into account the requirements below. In total there is 1 process chamber for wetting and drying to provide one process chamber for conditioning with two different etching solutions and electroplating 4 cells. All process chambers are equipped with all necessary media to provide so that the same four different electrolytes can be used in the plant and at least two wafers can be processed in parallel. The device is designed so that wafers can be processed in all popular sizes between 100 mm and 300 mm in each process chamber. The plant is to be constructed as a semi-automatic system, the process chambers loaded manually, but the wet chemical processes are controlled automatically. : The wafers to be processed are made of either glass, ceramics, silicon, gallium arsenide, indium phosphide, germanium, or a multilayer composite of these materials. Furthermore, organic-based materials such as plastic wafer (EWLP) should werden.Es edited the processing of round wafers with diameters of 100 mm, 150 mm, 200 mm and 300 mm is being considered.
Time limit for receipt of tenders or requests to participate:
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Tender documents : T17828209.html
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