ASE's capacity utilization rate for high-end packaging has increased recently on a pull-in of orders for handset-related ICs, said the sources. Meanwhile, the firm's utilization rate for system-in-package (SiP) packaging has risen since August, buoyed by growing demand for Wi-Fi modules and fingerprint sensors, the sources added.
SPIL has seen demand coming from the wireless communication sector ramp up, the sources indicated. As a major backend services provider for
A pick-up in orders from the games consoles segment will also buoy SPIL's sales performance in the latter half of the third quarter, the sources noted.
ASE has guided its core IC ATM (assembly, testing and materials) business would post a revenue increase of 1-5% sequentially in the third quarter of 2013, with gross margin staying flat at 24%.
SPIL also predicted that its third-quarter revenues would register a moderate on-quarter increase. Market watchers expect SPIL's third-quarter sales to enjoy a 6-8% sequential rise.
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