Patent application serial number 364907 is assigned to
The following quote was obtained by the news editors from the background information supplied by the inventors: "The present invention relates to integrated circuit packaging, and more particularly to pin fin heat sinks and construction methods.
"Cooling semiconductor devices generally requires the use of a relatively thick Thermal Interface Material (TIM) to absorb differences in surface flatness between a heat sink and a device being cooled. These materials and the processes for inserting them into systems increase thermal resistance and decrease system reliability for a variety of reasons. Compliant Thermal Interface (CTI) heat sinks circumvent this issue by having a surface that can conform to a surface of a chip. Such systems typically include a metal spring layer. These systems are expensive. Related Compliant Pin Fin (CPF) heat sinks include a bed of rigid pins, which generally incorporate internal springs. However, a useable process for creating such devices for either Single Chip Modules (SCMs) or Multi-Chip Modules (MCMs) has not been available."
In addition to the background information obtained for this patent application, VerticalNews journalists also obtained the inventors' summary information for this patent application: "A heat sink, in accordance with the present principles, includes a plurality of layers being disposed substantially parallel with a surface of a heat source. The layers include a plurality of pin portions spaced apart from each other in a planar arrangement wherein the pin portions of the layers are stacked and bonded to form pin fins extending in a transverse direction relative to the heat source to sink heat. At least one compliant layer is disposed between the pin fins and a mechanical load. The at least one compliant layer provides compliance such that the pin fins accommodate dimensional differences when interfacing with the heat source.
"A heat sink includes a plurality of pin portions spaced apart from each other in a planar arrangement. The pin portions are thermally conductive. Links connect at least one set of adjacent pin portions of the plurality of pin portions to form a planar sheet such that a ratio of a width of the pin portions to a width of the links is configured to make the planar sheet flexible.
"A method for forming a compliant heat sink includes providing a plurality of layers parallel with a surface of a heat source, where each layer includes a plurality of pin portions spaced apart from each other in a planar arrangement, and removable links connecting adjacent pin portions such that a ratio of a width of the pin portions to a width of the links is configured to make the planar sheet flexible; aligning pin portions of adjacent sheets; and bonding the pin portions of the adjacent sheets to form a stack of bonded sheets where the pin portions form columns of pin fins extending transversely from a heat source to heat sink the load.
"These and other features and advantages will become apparent from the following detailed description of illustrative embodiments thereof, which is to be read in connection with the accompanying drawings.
BRIEF DESCRIPTION OF DRAWINGS
"The disclosure will provide details in the following description of preferred embodiments with reference to the following figures wherein:
"FIG. 1 is a side view of an illustrative heat sink system with pin fins in an enclosure without links shown between pin portions and employing a compliant sheet in accordance with the present principles;
"FIG. 2 is a magnified view of Detail A of FIG. 1 showing the pin portions in greater detail in accordance with the present principles;
"FIG. 3 is a top view of a coolant flow enclosure with a top layer removed and showing a cross-sectional view taken at section line B-B depicting pin fins in the enclosure without links shown between pin portions in accordance with one embodiment;
"FIG. 4 is a side view of an illustrative heat sink system with pin fins in an enclosure without links shown where a portion if the enclosure includes a compliant sheet between pin portions in a heat sink stack in accordance with the present principles;
"FIG. 5 is a side view of an illustrative heat sink system with a compliant sheet with links in place between pin portions in a heat sink stack in accordance with the present principles;
"FIG. 6 is a side view of an illustrative heat sink system with links removed and showing two heat source devices in accordance with the present principles;
"FIG. 7 is a top view of a single heat sink sheet showing a link pattern and handler in accordance with one illustrative embodiment;
"FIG. 8 is a perspective image of a single heat sink sheet showing a link pattern in accordance with one illustrative embodiment;
"FIG. 9 is a perspective image a stack of heat sink sheets showing handlers in accordance with one illustrative embodiment; and
"FIG. 10 is a block/flow diagram showing a method for fabricating a heat sink stack in accordance with illustrative embodiments."
URL and more information on this patent application, see: Karidis,
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