The patent's assignee for patent application serial number 660584 is
News editors obtained the following quote from the background information supplied by the inventors: "Inventive concepts relate to a semiconductor and, more particularly, to semiconductor packages and methods of fabricating the same.
"One constant in the world of electronics is the demand for increased functional density: greater circuit capacity packed within ever-smaller volumes. One approach to achieving such miniaturization is a packaging technique referred to as 'package-on-package,' which unites a plurality of semiconductor packages as one. As the capacities of the united packages increase, the interconnection requirements may increase and, in order to satisfy the need for greater interconnection capacity without increasing the volume of the package-on-package, individual interconnections are reduced in size.
"In package-on-package structures top and bottom packages may be interconnected by solder balls to form a ball-grid-array (BGA) type semiconductor package. At high temperatures, one, or both, of the joined packages may warp, thereby jeopardizing solder joint reliability and the reliability of the stacked semiconductor devices. Additionally, the height (and overall volume) of the stacked package may be increased."
As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "Exemplary embodiments in accordance with principles of inventive concepts may provide package-on-package (POP) type semiconductor devices having improved mechanical durability and methods of fabricating the same.
"Exemplary embodiments in accordance with principles of inventive concepts may also provide POP type semiconductor devices capable of securing reliability of an electrical characteristic and methods of fabricating the same. A semiconductor package is thereby provided that improves reliability and decreases volume.
"Some features of inventive concepts may be that electrical connection part penetrating lower and upper packages may be formed to improve bonding strength and/or electrical connection reliability of the lower and upper packages. Other features of inventive concepts may be that warpage phenomenon of the lower and upper packages caused by a reflow process may be minimized. Still other features of inventive concepts may be that a gap between the lower and upper packages may be minimized to realize thin packages.
"In one aspect of exemplary embodiments in accordance with principles of inventive concepts, a method of fabricating a semiconductor package may include: providing a first package including a first semiconductor chip mounted on a first package substrate having a via-hole, the first semiconductor molded by a first mold layer; providing a second package including a second semiconductor chip mounted on a second package substrate having a connection pad, the second semiconductor chip molded by a second mold layer; stacking the first package on the second package to vertically align the via-hole with the connection pad; forming a through-hole penetrating the first and second packages and exposing the connection pad; and forming an electrical connection part in the through-hole, the electrical connection part electrically connecting the first package and the second package to each other.
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