The assignee for this patent, patent number 8506832, is
Reporters obtained the following quote from the background information supplied by the inventors: "Example embodiments relate to dividing a wafer, and more particularly, to a wafer dividing apparatus and method.
"Electronic appliances are designed for high performance, thereby resulting in higher operational speed of semiconductor devices contained therein. In addition, as the electronic appliances reduce in size, semiconductor device packages are also becoming smaller in size, slimmer and light in weight.
"A semiconductor assembly process includes, among other steps, dividing semiconductor integrated circuits formed in a wafer process, electrically connecting the semiconductor integrated circuits so that the semiconductor integrated circuits can be used as electronic components, sealing and packaging the semiconductor integrated circuits to protect them from external impact. A large number of identical semiconductor integrated circuits having identical electric circuits are formed on a single wafer.
"One of the primary processes of the semiconductor assembly process is a back-grinding process. The wafer having a relatively large diameter is manufactured relatively thick to minimize damage thereto during a manufacturing process. In a back-grinding process, the thickness of the wafer may be reduced by grinding a back surface of the wafer."
In addition to obtaining background information on this patent, VerticalNews editors also obtained the inventors' summary information for this patent: "According to example embodiments of the inventive concepts, a wafer dividing apparatus includes a chuck unit including upper and lower chucks; a cutting wire in a space between the upper and lower chucks, the cutting wire configured to cut a wafer and being driven by a first driving unit; and an etchant supplying nozzle configured to supply etchant to a groove of the wafer, the groove being formed by the cutting wire.
"According to example embodiments of the inventive concepts, the upper and lower chucks respectively include first and second recess regions that face each other and are configured to load the wafer.
"According to example embodiments of the inventive concepts, the wafer dividing apparatus further includes a deionized water supplying nozzle configured to supply deionized water to a portion of the wafer adjoining a portion to which the etchant is supplied.
"According to example embodiments of the inventive concepts, the upper and lower chucks further include respective protective members on edges portions of chuck surfaces, the respective protective members facing each other and protruding from the respective first and second recess regions.
"According to example embodiments of the inventive concepts, the protective members are formed of a material selected from the group consisting of ultra hard metal alloy, DLC (diamond-like carbon), diamond, and ceramic, and a combination thereof.
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