Patent number 8507328 is assigned to
The following quote was obtained by the news editors from the background information supplied by the inventors: "The semiconductor integrated circuit (IC) industry has experienced rapid growth. Technological advances in IC materials and design have produced generations of ICs where each generation has smaller and more complex circuits than the previous generation. These ICs include semiconductor light-emitting devices, such as Light Emitting Diodes (LEDs).
"Traditional methods of fabricating the semiconductor light-emitting devices focus on manufacturing LEDs one-by one. A manufacturing entity receives a multitude of individual LED dies. Wire bonding is used to electrically connect each of the LEDs to contacts on their respective dies. Phosphor glue is mixed by hand and then applied to the LEDs one-by-one. Lenses are then molded over each of the LEDs to encapsulate the LEDs, and the lenses can be made of an optical glue.
"The aforementioned process has some disadvantages. In one aspect, the one-by-one nature of the process can be quite inefficient and may result in very long manufacturing times for a batch of LED devices. Also, the hand-mixing step for the phosphor glue can be a relatively costly manufacturing process. Additionally, when the phosphor is very close to (or in contact with) an LED, it can experience thermal wear over time that can lower phosphor thermal efficiency. Therefore, while existing methods of fabricating light-emitting devices have been generally adequate for their intended purposes, they have not been entirely satisfactory in every aspect."
In addition to the background information obtained for this patent, VerticalNews journalists also obtained the inventors' summary information for this patent: "In one embodiment, a process for manufacturing semiconductor emitters includes providing a module that includes a substrate with a plurality of light-emitting devices disposed thereon, providing a lens board that has a plurality of transparent microlenses, in which phosphor is included as a part of the lens board, placing an optical glue on each of the microlenses, and aligning the lens board and the module using alignment marks on the lens board and the module. The aligning performed so that each one of the microlenses is aligned with a respective one of the light-emitting devices. The process also includes adhering the lens board to the module so that the optical glue prevents air gaps between the each of the light-emitting devices and the respective microlenses.
"In another embodiment, a semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.
"In yet another embodiment, a process for manufacturing a plurality of semiconductor emitters includes providing a lens board that has a plurality of lenses, applying transparent optical glue to each of the lenses, and drawing an adherent glue on a substrate, where the substrate has a plurality of light-emitting devices thereon. The adherent glue is drawn between adjacent ones of the light-emitting devices. The process also includes adhering the lens board to the substrate so as to eliminate air bubbles between each of the light-emitting devices and corresponding lenses."
URL and more information on this patent, see: Lin, Tien-Ming; Sun, Chih-Hsuan; Yeh, Wei-Yu. Systems and Methods Providing Semiconductor Light Emitters. U.S. Patent Number 8507328, filed
Keywords for this news article include: Electronics, Semiconductor,
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