The assignee for this patent, patent number 8507828, is
Reporters obtained the following quote from the background information supplied by the inventors: "The invention relates to a method for the production of a contact structure of a semiconductor component. The invention further relates to an intermediate product in the production of a semiconductor component.
"Semiconductor components, in particular solar cells, comprise contact structures. These contact structures have a significant influence on the quality, in particular the efficiency, of the solar cells. A conventional method for applying the contact structures comprises the application of a mask by means of a spin-on or a spray-on method, the mask then being structured by means of a photolithographic process. These methods are very laborious and expensive, making it difficult for them to be implemented economically in the mass production of solar cells."
In addition to obtaining background information on this patent, VerticalNews editors also obtained the inventors' summary information for this patent: "Therefore, it is the object of the invention to simplify a production method for contact structures of semiconductor components. Furthermore, it is the object of the invention to provide a semiconductor component comprising an economically producible contact structure.
"This object is achieved by a method for the production of a contact structure of a semiconductor component, the method comprising the steps of providing a two-dimensional semiconductor component comprising a first side and a second side which is opposite to said first side, and masking at least one of the sides by coating at least one of the sides with a coating and partially removing the coating in at least one predetermined region.
"This object is further achieved by an intermediate product in the production of a semiconductor component, the intermediate product comprising a two-dimensional semiconductor substrate comprising a first side and a second side which is opposite to said first side, and a mask which is applied to the semiconductor substrate and comprises openings which pass through the entire mask and are laterally bounded by steep flanks.
"The gist of the invention is to provide a semiconductor substrate with a masking. The mask is advantageously produced by immersing the semi-conductor substrate into a resist solution which is then structured by means of laser ablation. A method of this type is simple and economical. Furthermore, a high accuracy is achieved.
"Features and details of the invention will become apparent from the description of an embodiment by means of the drawing."
For more information, see this patent: Krause, Andreas; Bitnar,
Keywords for this news article include: Electronics, Semiconductor,
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