The orders are for multiple Advanced Burn-in and Test Systems (ABTS™) and a follow-on MAXTM system. The ABTS systems feature a new low-cost high-volume configuration targeted at production test and burn-in of lower-power devices. This new ABTS offers the option of high voltage
"We are pleased to receive these orders for production test and burn-in systems," said
"The new configuration extends our already successful ABTS-Pi system, which features Individual Temperature Control of each device for high power applications, to provide a lower cost and higher parallel solution for automotive, standard logic and high voltage applications," Buck concluded.
The ABTS family of products is based on a new hardware and software platform that is designed to address not only today's devices, but also future devices for many years to come. It can test and burn-in both logic and memory devices, including resources for high pin-count devices and configurations for high-power and low-power applications. The ABTS system can be configured with up to 72 burn-in boards with up to 320 I/O channels each and 32M of test vector memory per channel. The ABTS system is optimized for use with the Sensata iSocket* Thermal Management Technology, which provides a scalable cost-effective solution using individual device temperature control for ICs up to 75 watts or more. Individual temperature control enables high-power devices with a broad range of power dissipation to be burned-in simultaneously in a single burn-in chamber while maintaining a precise device temperature. The ABTS system also uses N+1 redundancy technology for many key components in the system to maximize system uptime.
*iSocket is a trademark of
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