Patent number 8610135 is assigned to
The following quote was obtained by the news editors from the background information supplied by the inventors: "The present invention relates to a light-emitting device and a substrate for mounting light-emitting elements, and particularly relates to a high-flux (high-output) light-emitting device in which a plurality of LED (light-emitting diode) elements are mounted on a substrate, and to a substrate for the light-emitting device.
"With the recent increase in awareness toward environmental protection, high-flux (high-output) light-emitting devices in which LED elements are mounted are being used in various illumination devices instead of incandescent light bulbs and fluorescent lights.
"Examples of high-flux light-emitting devices include those in which comparatively large-size and high-power LED elements are mounted, and those in which high output can be obtained by mounting a plurality of comparatively small-size and small-power LED elements. The latter are often more advantageous in terms of diffusing the heat source and electric current, luminous efficiency, and the cost per element surface area.
"There is disclosed in Patent Document 1 (JP-A 2004-241509) an LED light source comprising a plurality of LED elements mounted on a print substrate, a reflective plate which has a plurality of apertures provided in correspondence with the LED elements and in which the lower surface is joined to the print substrate via an adhesive, and an encapsulation resin packed into each of the apertures. It is also noted that the reflective plate is composed of aluminum, and is manufactured by press working."
In addition to the background information obtained for this patent, VerticalNews journalists also obtained the inventors' summary information for this patent: "In affixing a reflective plate such as shown in Patent Document 1 to a print substrate using an adhesive, adhesive seeps out from the lower surface of the reflective plate and penetrates the apertures, exerting a negative influence on the optical output. The seeping adhesive also clings to the bonding wire, and there is concern that stress due to differences in the coefficient of thermal expansion between the encapsulation resin and the adhesive will cause the bonding wire to break. The reflective plate is molded by press working, and therefore modifications of the design of the reflective plate, specifically, modifying the shape or size of the apertures, modifying the thickness of the reflective plate, and other such modifications necessitate creation of a new die and incur cost. Therefore, it is difficult to flexibly design or manufacture variations of the product.
"An object of the present invention, which was perfected by taking the aforementioned points into consideration, is to provide a substrate for mounting light-emitting elements that can flexibly design or manufacture variations of the product, a light-emitting device, and a manufacturing method therefor; and in particular a light-emitting device having a plurality of LED elements on a substrate and a frame body surrounding the perimeter of each of the LED elements, wherein it is possible to form the frame body on the substrate without using an adhesive.
"A substrate for mounting light-emitting elements of the present invention is a substrate for mounting light-emitting elements provided with a frame body on one surface of the substrate, wherein the frame body is composed of a layered body of a plurality of glass films having apertures and being layered in a light-projecting direction, and an area of the apertures in the glass film adjoining the substrate is less than an area of the apertures in another glass film.
"A method for manufacturing the substrate for mounting light-emitting elements of the present invention comprises a step of providing the glass films by printing.
"A light-emitting device of the present invention, the light-emitting device having the substrate for mounting light-emitting elements, wherein the light-emitting device has light-emitting elements mounted on the substrate in positions corresponding to the apertures of the frame body.
"A method for manufacturing a light-emitting device of the present invention, comprising the steps of forming a frame body for surrounding each of a plurality of light-emitting element mounting regions on one surface of a substrate, and mounting a light-emitting element in each of the light-emitting element mounting regions on the substrate subsequent to forming the frame body; wherein the step for forming the frame body includes a step for carrying out glass printing several times, and providing the substrate with a plurality of layered glass films having a plurality of apertures.
"Since a frame body is provided on the substrate without using an adhesive in the substrate for mounting light-emitting elements and the light-emitting device of the present invention, it is possible to eliminate the negative influence on optical output and reliability due to seepage of the adhesive. The frame body in the present invention can be formed by glass printing, and it is therefore possible to flexibly design or manufacture variations of the product."
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