New AirPrime® HL Series modules are the smallest embedded wireless
modules to be completely
interchangeable across 2G, 3G, and 4G technologies; offer choice of snap-in connectivity or solder-down for scalable production; and are future-proof, thanks to over-the-air upgradability
The AirPrime HL Series is designed to be flexible, providing manufacturers with the choice of soldering down the module for efficient high-volume production, or using an innovative snap-in socket. With the snap-in socket, device manufacturers can quickly place the module in the device any time in the production cycle and swap 2G modules for 3G or 4G modules in the future, even in completed and field-deployed devices. With both the snap-in and solder-down options, manufacturers can leverage one design for their 2G, 3G, and 4G deployments, simply by changing the module installed in production – no other changes to the device design would be required.
In addition to the flexible hardware design, the AirPrime HL Series is designed to be future-proof. With AirVantage Management Service, an off-the-shelf cloud-based M2M platform from
“We know that integrating new technology is one of the key challenges our customers face in their M2M deployments and it can prevent customers from deploying or evolving to new technologies as quickly as they would like to,” said
The AirPrime HL Series is ideal for M2M communications applications in point-of-sale, smart grid, and fleet management or tracking, with GNSS (GPS and GLONASS) included. Samples of the first product in the series, called the HL6528 (2G), are available now with commercial shipments expected to begin in the first quarter of 2014. Samples of the HL8548 (3G) are expected to be available in the first quarter, with commercial shipments expected in mid-2014. 4G LTE versions will follow, with more specific launch dates to be announced later.