By a News Reporter-Staff News Editor at Electronics Newsweekly -- Researchers detail new data in General Science. According to news reporting originating from Espoo, Finland, by VerticalNews correspondents, research stated, "A variety of plastic products, ranging from those for daily necessities to electronics products and medical devices, are produced by moulding techniques. The incorporation of electronic circuits into various plastic products is limited by the brittle nature of silicon wafers."
Our news editors obtained a quote from the research from Aalto University, "Here we report mouldable integrated circuits for the first time. The devices are composed entirely of carbon-based materials, that is, their active channels and passive elements are all fabricated from stretchable and thermostable assemblies of carbon nanotubes, with plastic polymer dielectric layers and substrates. The all-carbon thin-film transistors exhibit a mobility of 1,027 cm(2)V(-1)s(-1) and an ON/OFF ratio of 10(5). The devices also exhibit extreme biaxial stretchability of up to 18% when subjected to thermopressure forming. We demonstrate functional integrated circuits that can be moulded into a three-dimensional dome."
According to the news editors, the research concluded: "Such mouldable electronics open new possibilities by allowing for the addition of electronic/plastic-like functionalities to plastic/electronic products, improving their designability."
For more information on this research see: Mouldable all-carbon integrated circuits. Nature Communications, 2013;4():131-138. Nature Communications can be contacted at: Nature Publishing Group, Macmillan Building, 4 Crinan St, London N1 9XW, England. (Nature Publishing Group - www.nature.com/; Nature Communications - www.nature.com/ncomms/)
The news editors report that additional information may be obtained by contacting D.M. Sun, Aalto Univ, Multidisciplinary Inst Digitalisat & Energy, FI-00076 Espoo, Finland. Additional authors for this research include M.Y. Timmermans, A. Kaskela, A.G. Nasibulin, S. Kishimoto, T. Mizutani, E.I. Kauppinen and Y. Ohno.
Keywords for this news article include: Espoo, Europe, Finland, Electronics, General Science
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