The GE Phoenix x-ray machine will further Axiom Electronics’ reputation for high reliability SMT assembly. Solder joint quality and reliability becomes more challenging as component geometries shrink. Preventing solder joint failure and maintaining high-reliability comes down to how well components are soldered during the manufacturing process. Advanced 2D and 3D x-ray imaging technology enables Axiom to inspect solder joints, components (i.e. wire bonds) and printed circuit boards (i.e. buried vias) that could not be inspected with previous generation 2D x-ray technology.
Computer tomography enables Axiom to see a complete 3D model of solder joints and other features. This capability is particularly useful for process development (designed experiments) and failure analysis. Small differences in the height of a solder joint, the angle of attachment, or problems with blind or buried vias can result in field failures. These problems should be addressed and prevented in manufacturing before the product is shipped.
Along with these new inspection capabilities, cycle times on this tool are reduced with fast, efficient programming and setup linked with the automated CAD programming tools, so extra programming is minimized and manufactured product moves swiftly through the inspection cycle.
Read the full story at http://www.prweb.com/releases/Axiom_Electronics/Electronics_Manufacturing/prweb11264454.htm
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