Patent number 8552442 is assigned to
The following quote was obtained by the news editors from the background information supplied by the inventors: "The present invention relates to a surface mount type light emitting device incorporating a semiconductor light emitting element.
"FIG. 11 shows an example of conventional top view type semiconductor light emitting device (see JP-A-2003-188418). The semiconductor light emitting device X shown in the figure includes leads 91A and 91B, an LED chip 92 and a resin package 93. The LED chip 92 is mounted on the lead 91A. The LED chip 92 is connected to the lead 91B via a wire. The resin package 93 covers the LED chip 92 and part of each lead 91A, 91B. The resin package 93 is formed with a lens 93a. The portions of the leads 91A and 91B which project from the resin package 93 are utilized as connection terminals 91Aa and 91Ba. The semiconductor light emitting device X is soldered to a substrate B. Specifically, the connection terminals 91Aa and 91Ba are inserted into through-holes formed in the substrate B, and the portions of the terminals which project from the through-holes are fixed to the substrate B with solder S.
"In recent years, to mount various kinds of electronic components on a circuit board, surface mounting using e.g. a reflow furnace is widely performed. With this technique, many electronic components can be collectively mounted. Thus, there is an increasing demand for a semiconductor light emitting device which can be surface-mounted unlike the above-described semiconductor light emitting device X."
In addition to the background information obtained for this patent, VerticalNews journalists also obtained the inventors' summary information for this patent: "The present invention has been proposed under the circumstances described above. It is, therefore, an object of the present invention to provide a semiconductor light emitting device which can be surface-mounted.
"According to a first aspect of the present invention, there is provided a semiconductor light emitting device comprising a semiconductor light emitting element, a lead electrically connected to the semiconductor light emitting element, and a resin package covering the semiconductor light emitting element and part of the lead and including a lens facing the front of the semiconductor light emitting element. The lead includes an elongated mounting portion projecting from the resin package. The mounting portion includes a pair of first projections spaced from each other in the longitudinal direction and a second projection positioned between the first projections. The first projections and the second projection project in opposite directions from each other in the width direction of the mounting portion.
"Preferably, the mounting portion extends in either one of a first direction which is parallel to the optical axis of the lens and a second direction which is perpendicular to the first direction. The lead includes an additional mounting portion extending in the other one of the first direction and the second direction.
"According to a second aspect of the present invention, there is provided a semiconductor light emitting device comprising a semiconductor light emitting element, a first and a second leads electrically connected to the semiconductor light emitting element, and a resin package covering the semiconductor light emitting element and part of each of the leads and including a lens facing the front of the semiconductor light emitting element. Each of the first and the second leads includes a mounting portion projecting from the resin package and elongated in a direction perpendicular to the optical axis direction of the lens. The mounting portion of the first lead and the mounting portion of the second lead extend parallel to each other. The position at which the first lead projects from the resin package and the position at which the second lead projects from the resin package are opposite from each other in the direction in which the mounting portions extend.
"Preferably, the semiconductor light emitting device provided according to the second aspect further comprises a standing portion extending from each of the mounting portions in the optical axis direction of the lens.
"Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings."
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